• Electromagnetic hot melt application head for glue beads and dots
• Application frequency: 600 Hz
• 10 times longer service life, compared to electropneumatic hot melt application heads
• Reduction of operating noise by 30 dB – compared to electropneumatic hot melt application heads – to 65 dB
• Cost savings through elimination of the compressed-air supply
• For use with Xmelt hot melt systems with Xpect / VE04 Controller
• Max. pressure 80 bar
• Integrated overtemperature cut-out
• Plug-in module
• Thermal insulation
• The nozzle is opened electrically and closed by spring Action
• Dot application even at the highest machine Speeds
• Excellent cut-off characteristics, even during high-speed, intermittent gluing
• Compact design
• Suitable for adhesives with viscosities up to 5,000 mPa.s
• Glue saving due to dot application

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